Implementing And Optimizing Lead-Free SMT Assembly

Objectives of the Workshop:

This advanced 2-day course is intended to provide the experienced participant with a thorough yet practical overview of Lead-free Surface Mount Technology manufacturing. High manufacturing yield can best be attained by understanding and successfully implementing and optimizing the appropriate process considerations.

This workshop will give the participant a true comprehension of the SMT assembly processes and associated materials. Optimization of the Lead-free SMT assembly process will be covered, step by step including Screen/Stencil Printing, Component Placement, Reflow and Inspection as well as the various aspects of solder paste, design considerations, inspection and rework.

Failure Analysis, Reliability and Six-Sigma principles will also be discussed. Lead-free manufacturing case studies will be included. Most important, particular attention will be paid to the sources of problems that occur within the assembly process.

Topics Covered:

Introduction

1. Lead-Free and RoHS
   • EU RoHS
   • China RoHS
   • Lead-free and the SMT Assembly Process
2. Lead-free Design for Manufacturability (DFM) and Design for Excellence (DFX)
   • When to Use DFX
   • DFX and Quality
   • PCBA DFM
   • PCBA DFM Case Studies
   • Reflow
   • Wave Soldering
   • Cleaning
   • Manual Assembly
3. PCB and Materials
   • Manufacturing Concerns for PCB Design
   • CAD and CAM Required Information
   • Design Rules for PCBs
     • Lead-free PCB considerations
   • Solder Paste
     • Flux Classification and Comparison
     • Test Requirements for Flux
     • Solder Paste Evaluation
       • Lead-free Comparison and Summary
       • No-clean Paste Innovations
     • Lead Free Issues and Concerns
       • INEMI Results
4. Component Considerations
   • Types of Components
   • Moisture Sensitive Devices (MSD)
   • Packaging Trends
5. Solder Paste Printing and Deposition
   • Deposition Basics
   • Stencil Engineering
     • Stencil Thickness and Solder Paste Classification
     • Stencil Aperture Shape
     • Considerations for 0102 and 01005 components
   • Impact of Material and Equipment
   • Stencil Printing Process Steps
   • Printing Defect Root Cause and Resolution
     • Tombstoning
     • Mid-chip Solder Balls
   • Lead-Free Issues and concerns
     • How is Lead-free Printing different?
     • Problems and Resolution
   • Printing Defect Prevention
   • Printing Defect Troubleshooting
6. Component Placement
   • SMT Placement Process
   • DFM for Component Placement
   • Placement Accuracy
     • 0201 considerations
   • Placement Process
   • Placement Machine Classification and Characteristics
   • Feeders
   • Component Packaging
   • Placement Issues
     • Component Self-Centering
     • Fine Pitch Leads
     • BGAs
     • CSP Standards
   • Component Placement Optimization Strategies
     • Rapid Deployment Set-up
     • Line Balancing
   • Component Placement Troubleshooting
     • Common Problems and Resolution
7. Wave and Selective Soldering
   • DFM for Wave Soldering
   • Selective Soldering
   • Temperature Profile for Wave Soldering
   • Wave Solder Process Steps
   • Flux Spraying
   • Lead-free Wave Solder Process Considerations
   • Wave Solder Process Troubleshooting
     • Common Problems and Resolution
8. Reflow Soldering
   • DFM for Reflow
   • Reflow Profile
   • Reflow Process Considerations
   • Lead-free Reflow Considerations
   • Atmospheric Soldering (Nitrogen)
   • Reflow Profile Optimization
   • Reflow Process Troubleshooting
9. Rework
   • Principles of Rework
   • BGA Rework
   • Challenges of Lead-free Rework
10. Inspection
    • Solder Joint Quality and Reliability
    • Inspection Methodology and Equipment
    • In-Process Inspection
    • Automated Optical Inspection (AOI)
    • X-Ray and X-Ray Laminography Inspection
    • AOI vs. AXI
    • Inspection based on Probability
    • Defect Root Cause Identification
    • DPMO Process
    • Inspection Case Study
11. Failure Analysis for SMT Manufacturing
    • Principles of Failure Analysis
    • Recognizing Failure Mechanisms
    • Root Cause Analysis
    • FA Case Studies
12. Reliability and Six-Sigma
    • Prinicples of Reliability
    • Principles of Six-Sigma
    • Solder Joint Reliability

General Discussion and Q&A

Who Should Attend:

This course is intended for Manufacturing, Process, Design, Test and Quality Engineering personnel as well as Management who are experienced in SMT assembly and want to further their expertise in implementing and troubleshooting the processes, equipment, and materials involved in modern electronic assembly technology.