![]() |
||
Lead-FreeWhat You Need To Know The elimination of lead from electronic assemblies is already underway in Europe and Asia, and will most likely become universal throughout the electronics industry within the next 2 - 3 years. Events are moving very fast. Further development of government regulations and initiatives (Japan and Europe have already invoked Lead-Free deadlines), the impact of major corporations marketing Lead-Free products as "environmentally friendly", and the ability to buy or sell products globally - these may all be factors that will shorten the time you have to adopt Lead-Free. Making the Transition
Solder materials enter the manufacturing stream as surface coating on PCB's and substrates, component leads and terminations, internal connections within components, as well as solder pastes, bars, and wire. To achieve true lead-free products, all of these must be eliminated and in most cases replaced with some other material that does not contain lead. Additionally, evaluation of the assembly process will be necessary to determine best practices for soldering processes and profiles. ITM's Lead-Free
Process Audit ITM Services Help You Go Lead-Free
For more information, contact: itm@itmconsulting.org | ||


