A one day course designed to give the participant a good understanding of the No-Clean solder process.
The composition and characteristics of the different types of no-clean solder pastes and fluxes are discussed. Equipment and process parameters are examined along with the risks and demands of the process.
Solder paste evaluation procedures, changes in the appearance of the finished joint and guidelines for integrating no-clean into the assembly process are presented.
For more information, please contact: itm@itmconsulting.org
