A Course For the Designer: An Assembler's Point of View
To provide a printed circuit design that can be:
1. reproduced in an efficient and cost effective fashion
2. converted into a high quality, reliable and functional electronic product
the designer must have a grasp of the total assembly process.
In addition to designing for speed, frequency and packaging requirements, the successful designer must also know the characteristics and capabilities of the SMT assembly process. This includes:
This on-site course provides designers of electronic products with a broad overview of the SMT assembly processes, the equipment used and the design issues involved.
The designer takes a walk in the assembler's shoes and learns how design affects manufacturing capability and yield - and how, if analyzed early enough in the build cycle, the assembler's capabilities will affect the design. Equipment, processes and materials specific to the client will receive additional focus.
I. Substrates
Typical Materials
PCB Structure and Dimensional Specifications
TCE Mismatches
Substrate Material Properties and Applications
Substrate Selection Criteria
Typical PCB Specifications
Design Considerations for Manufacturing
Recommendations for High Yield/Low Cost PWB Fabrication
II. Component Considerations
Overview of Package Types
New & Emerging Packages
Standardization Rules for Design
Component Density
Recommended Land Patterns for New Packages
Connector Types & Considerations
III. Layout Geometries: Chip Components & Actives
Solder Pad Design
Solder Mask Design
Trace-Pad Design
Component Orientation
IV. Design Guidelines for SMT
Fiducial Marks
Conductor Routing
Via Hole Placement
Mixed Technology Considerations
Component Spacing
Component Orientation
Component Location
Edge Clearances
Design for Inspectability
Design for Repairability
V. Design Standards
VI. Assembly and Soldering Process Considerations
Printing
Component Placement
Reflow
VII. Factors Impacting Factory Design
VIII. Design for Testability
The Test Concept
Probe Access Planning
Probe Size and Spacing Considerations
Fixture Design Considerations
Design for Test Guidelines
Test Pad Design Recommendations
IX. Packaging and Process Directions and Impact
BGA
CSP and Flip Chip
Reflow of Through-hole
OSP
No-Clean Process
X. Discussion
Questions and Answers pertaining to specific application problems
