This course will give the participant a broad overview of SMT assembly processes and the design issues associated with manufacturing surface mount, electronic products.
Participants will learn how the design affects manufacturing capability and yield — and, if analyzed early enough in the build cycle, how manufacturing capabilities should affect the design.
This course is intended for Manufacturing, Process, Test and Quality Engineering personnel as well as Management who want to become more familiar and comfortable with the Design for Manufacturability requirements of the SMT assembly process.
A detailed 10-part course, Design for SMT Manufacturability will give the participant a complete understanding of the need for DFM in the manufacturing environment.
I. Substrates
Typical Materials
PCB Structure and Dimensional Specifications
TCE Mismatches
Substrate Material Properties and Applications
Substrate Selection Criteria
Typical PCB Specifications
Design Considerations for Manufacturing
Recommendations for High Yield/Low Cost PWB Fabrication
II. Component Considerations
Overview of Package Types
New & Emerging Packages
Standardization Rules for Design
Component Density
Recommended Land Patterns for New Packages
Connector Types & Considerations
III. Layout Geometries: Chip Components & Actives
Solder Pad Design
Solder Mask Design
Trace-Pad Design
Component Orientation
IV. Design Guidelines for SMT
Fiducial Marks
Conductor Routing
Via Hole Placement
Mixed Technology Considerations
Component Spacing
Component Orientation
Component Location
Edge Clearances
Design for Inspectability
Design for Repairability
V. Design Standards
VI. Assembly and Soldering Process Considerations
Printing
Component Placement
Reflow
VII. Factors Impacting Factory Design
VIII. Design for Testability
The Test Concept
Probe Access Planning
Probe Size and Spacing Considerations
Fixture Design Considerations
Design for Test Guidelines
Test Pad Design Recommendations
IX. Packaging and Process Directions and Impact
BGA
CSP and Flip Chip
Reflow of Through-hole
OSP
No-Clean Process
X. Discussion
Questions and Answers pertaining to specific application problems
