These on-location courses will give the participant a true comprehension of the SMT assembly processes and associated materials. High yields in surface mount PCB assembly manufacturing can best be attained by understanding and successfully implementing the appropriate process considerations.
One Day Course - Course A
A one day overview of the various facets of SMT including Ball Grid Array (BGA), CSP, Passive and QFP components; materials, such as adhesives and solder paste, pick and place, screen printers and oven equipment, and processes. It will provide the participant with a thorough yet practical overview of Surface Mount Technology manufacturing. The SMT assembly process will be covered, step by step.
This course is intended for Manufacturing, Process, Design, Test and Quality Engineering personnel as well as Management that are just getting involved in SMT assembly and want to become familiar and comfortable with the process and related technologies
Topics Covered:
I. The SMT Concept
II. Solder Paste
III. Solder Paste Printing and Deposition
IV. Automatic Component Placement
V. SMT Soldering
Two Day Seminar - Course B
This two day seminar offers a comprehensive understanding of the surface mount assembly process. The SMT model is reviewed as well as the different types of SMT assemblies. SMT processes and equipment including solder paste printing, adhesive dispensing, component placement, reflow, wave soldering, cleaning, inspection and rework are examined in detail.
The course also covers material selection considerations including substrate, solder paste and components as well as key design criteria. Technology directions such as BGA and other array technologies, as well as lead free solders, and other alternatives are also examined.
For more information on
1-day SMT Manufacturing courses
2-day SMT Manufacturing seminars
Contact: itm@itmconsulting.org
