With the increasing use of area array packages in electronic products, such as Ball Grid Arrays (BGA) and Chip Scale Packages (CSP), correct and repeatable solder paste deposition is vital to achieving high yields and profitability.
ITM's consultants will conduct a hands-on evaluation of your electronics assembly processes, as they specifically relate to the stencil printing and post-paste inspection for SMT Components.
The Screen/Stencil Printing process will be examined in detail, including:
Once the evaluation has been completed, ITM will present a written report that includes results plus three levels of recommendations:
Required corrective actions which are necessary to ensure overall product quality
Improvements which could enhance the output and capabilities of the production facility
Experiments and investigations which need to be considered for long term technical capability and productivity.
For more information, please contact: itm@itmconsulting.org
