Troubleshooting the Lead-Free SMT Assembly Process

The adaptation of lead-free solder alloys (along with PCB and component lead finishes) presents additional demands to the already challenging SMT assembly process. This course is intended to provide the participant with an understanding of how to identify and correct most Lead-Free (and Non Lead-Free) SMT assembly problems.

Vendor and design related problems will be thoroughly examined. A step-by-step investigation of the reflow soldering process (including solder paste deposition) with related problems and remedies will help the participant achieve high-yield manufacturing. Existing Lead-free Workmanship standards are also discussed.

The course will provide problem-solving tools for those involved in the manufacturing of Lead-free SMT circuit board assemblies.

Topics Covered:

1. SMT Manufacturing
   • Lead-Free SMT Process - Limitations and Advantages
   • High Yield Manufacturing Philosophy
2. The Role of Design for Manufacturabilty
   • Impact of Design on assembly
   • Specification Development
3. Stencil Printing
   • Deposition Basics
   • Screen and Stencil Engineering
   • Control and Variables
   • Solder Paste Deposition Process Trouble-shooting
4. SMT Soldering
   • Reflow Process Considerations
   • Atmospheric Soldering (Nitrogen)
   • Reflow Specification Development
   • Reflow Process Troubleshooting
5. Inspection and Workmanship Standards
6. Lead-free Rework
   • Rework Basics
   • Rework Process Troubleshooting
7. Questions and Discussion

Who Should Attend:

This course is intended for Manufacturing, Process, Design, Test and Quality Engineering personnel as well as Management who are involved in the design or production of surface mount or mixed technology assemblies.